DataFest – Become a Sponsor and help underwrite this event πŸ—“

— A 48 hr data hackathon for undergrads

Sponsored by The American Statistical Association
Meeting Dates: May 3 – 5, 2019

Location: Chapman University, Orange CA

Information and registration: www.conference.org

Summary:
ASA DataFestTM is a data hackathon for undergraduate students, sponsored by the American Statistical Association. ASA DataFestTM at Chapman is hosted by the Schmid College of Science and Technology and Office of Residential Life.

Analyze ASA DataFestTM introduces you to what is likely the richest, most complex dataset you’ve seen so far in your undergraduate career. The dataset is provided by a real-life organization and is chosen to provide many avenues of discovery. Students at any stage of their data science education will find something of interest and will have the opportunity to make an original finding. Students from any major are welcome.

Network Mingle with data science professionals who visit DataFestTM to offer their advice and answer your questions. You also get to meet students from other colleges and universities in southern California.

Experience Past participants of the ASA DataFestTM have gone to job interviews able to describe technical challenges overcome, explain how they work under time-pressure, and talk about their thoughts on solving real-life data problems.

2019 IEEE Applied Power Electronics Conference and Exposition (APEC) πŸ—“

— The conference addresses issues of immediate and long term importance to practicing power electronics engineer

Meeting Dates: March 17 – 21, 2019

Location: Anaheim, CA

Information and registration: www.conference.org
Summary: APEC focuses on the practical and applied aspects of the power electronics business. The conference addresses issues of immediate and long term importance to practicing power electronics engineer

2019 Optical Fiber Communications Conference and Exhibition (OFC) πŸ—“

— the largest global conference and exhibition for optical communications and networking professionals

Meeting Dates: March 3 – 7, 2019

Location: San Diego Convention Center, San Diego

Information and registration: www.conference.org
Summary: The Optical Fiber Communication Conference and Exhibition (OFC) is the largest global conference and exhibition for optical communications and networking professionals. For over 40 years, OFC has drawn attendees from all corners of the globe to meet and greet, teach and learn, make connections and move business forward. OFC attracts the biggest names in the field, offers key networking and partnering opportunities, and provides insights and inspiration on the major trends and technology advances affecting the industry. From technical presentations to the latest market trends and predictions, OFC is a one-stop-shop.

IEEE Heterogeneous Integration Roadmap Symposium (HIRS) πŸ—“ πŸ—Ί

— subsystem integration, Moore’s Law advances, release of v1.0, working group overviews, breakout sessions …

register Sponsors: IEEE-SCV EPS, EDS and Photonics Chapters; SEMI Int’l; ASME SF Section
Meeting Dates: February 21-22, 2019 (attend either, or both)
Time: 8:30 AM – 6:00 PM (PT)
Speakers: Chairs of Working Groups (from Intel, Boeing, Fraunhofer, NASA, Infineon, ASE, ITRI, SEMI, more)
Location: SEMI International Headquarters, Silicon Valley, CA
Cost: $25 IEEE members, $40 non-members ($10 more, after Feb 8)
RSVP: requested, through website
Event Details: www.cpmt.org/scv
Summary: Heterogeneous Integration will be the key technology direction going forward, for device and subsystem integration. It is the “low hanging fruit” for initiating a new era of technological and scientific advances to continue and complement the progression of Moore’s Law scaling into the distant future. Day 1: Introduction to HIR v1.0: — Release of HIR version 1.0: How to Download and Use the Roadmap; — Presentations from HIR Technical Working Group chairs. Day 2: TWG Breakout Sessions for HIR v2.0 — Working Group Caucus & Cross-Group meetings. Come for either or both days. Corporate sponsorships/exhibits available.
Visit website for full listing of Working Group talks, Keynote, etc.

2019 IEEE 13th International Conference on Semantic Computing (ICSC) πŸ—“

Meeting Dates: Jan 30, 2019

Location: Newport Beach, CA

Information and registration: www.conference.org
Summary: Content Analysis (from contents to semantics) Structured data image and video audio and speech big data natural language deep learning Description and Integration (of data and services) Semantics description languages ontology integration interoperability Use of Semantics in IT Applications Multimedia IoT cloud computing SDN wearable computing mobile computing search engines question answering robotics web service security and privacy Use of Semantics in Interdisciplinary Applications biomedicine healthcare manufacturing engineering education finance entertainment business science humanity ​Interface Natural language multi-modal

2018 IEEE Global Conference on Signal and Information Processing (GlobalSIP) πŸ—“

–It focuses broadly on signal and information processing with an emphasis on up-and-coming signal processing themes.

Meeting Dates: November 26 – 28, 2018

Location: Anaheim

Information and registration: www.conference.org

Summary:
It focuses broadly on signal and information processing with an emphasis on up-and-coming signal processing themes.

2018 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) πŸ—“

— New challenges and innovative solutions for integrated circuit design technology and systems

Meeting Dates: November 5 – 8, 2018

Location: San Diego

Information and registration: www.conference.org
Summary:
ICCAD serves EDA and design professionals, highlighting new challenges and innovative solutions for integrated circuit design technology and systems

2018 IEEE Brain Initiative Workshop on Advanced NeuroTechnologies for BRAIN Initiatives (ANTBI) πŸ—“

— Development of novel technological innovations

Meeting Dates: November 1 – 2, 2018

Location: San Diego

Information and registration: www.conference.org
Summary:
The IEEE Brain Initiative Workshop will highlight the development of novel technological innovations, including engineered neuro-materials based implants, opto-genetics, to treat and monitor, traumatic brain injury, cognitive brain impairments, stroke and spinal cord injury etc. We also highlight translational clinical research on human-machine interface systems to significantly restore, and enhance, the impaired sensory functions and motor systems. Furthermore, global neuro-technology industry trends, nano devices, computational advances, and stem cell engineering for the treatment of neurological diseases, from the molecular to systemic levels, will be discussed.