2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 🗓

from to
Conference
San Diego Map

IEEE Electronics Packaging Society
Meeting Dates: May 29 – June 1, 2018

Location: San Diego
RSVP: At ITherm
Summary:
The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.