2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 🗓

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IEEE Electronics Packaging Society
Meeting Dates: May 29 – June 1, 2018

Location: San Diego
RSVP: At ITherm
The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.