POSTPONED UNTIL FURTHER NOTICE — Toward 100Gbps Fully Integrated Wireless Communication Transceivers šŸ—“

— Hear about way of implementing highly integrated ultra-high-speed wireless transceivers.

Webinar
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IEEE Joint Foothill and OC Sections Nanotechnology Council Chapter
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Meeting Date: March 24, 2020
Time: 11:30 AM Networking & Food; 12:00 PM Presentation
Speaker: Huan Wang
Location: Cal Poly Pomona
Cost: none
RSVP: requested, through website
Event Details: IEEE vTools

Summary:
The future’s more connected societies are in sore need of high-speed point-to-point wireless links with a data rate comparable to wireline links in both indoor short-range and outdoor long-range scenarios. Enabling applications include: optical fiber replacement, high-capacity backhauls, close-proximity wireless data transfer, etc. High-speed communication relies on two major factors: bandwidth and modulation format. The vastly under-utilized mm-wave to sub-THz band is very attractive for this application. However, the abundance of bandwidth in mm-wave/sub-THz bands cannot be easily utilized with commercially available low-cost Silicon-based fabrication technologies. Meanwhile, increasing modulation order puts stringent requirement on the high-speed mixed-signal interface design, i.e. analog-to-digital converters, digital-to-analog-converters and digital signal processors. In short, conventional transceiver architectures encounter serious bottleneck that limits achievable data rate and posts significant concerns on system cost and efficiency. The state-of-the-art solutions will be presented and discussed first, followed by our proposed way of implementing highly integrated ultra-high-speed wireless transceivers.

Bio:
Huan Wang (Sā€™11) received his B.S. degree from Zhejiang University, Hangzhou, China, in 2011, and the M.S. degree in electrical and computer engineering from The University of Texas at Austin, Austin, Texas, USA, in 2013. He is currently working toward his Ph.D degree in electrical engineering at the University of California, Irvine, CA, USA. From 2013 to 2015, he was with Cirrus Logic, Austin, Texas, as an analog design engineer, where he was involved in the design of audio class-D amplifiers for mobile applications. He was an engineering intern with Qualcomm during the summer of 2012, 2016 and 2019, where he worked on the design of RF transceivers for cellular applications. His current research interest includes RF, mm-wave/THz circuits and system design for wireless communications.