SCV Electron Devices, Electronics Packaging, and Photonics Chapter
Location: on the Internet
Event Details & Registration: ieee.org
With increasing interest in on-package integration, there is a need to describe package architectures and their interconnect capabilities in a simple and consistent manner. We will define a new standardized nomenclature covering both 2D and 3D constructions, and also key metrics. Also: support for increasing on-package bandwidth requirements; efficient power delivery; and low-loss high-speed signaling.