Heterogeneous Integration Roadmap (HIR) Webinar Series 🗓

Webinar
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IEEE Electronics Packaging Society
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Webinar Date: August 6, 2020 8AM
Speaker: Bill Bottoms and Amr Helmy

Location: on the Web

Cost: none
RSVP: VIRTUAL TECHNICAL TALK: Must register to receive Webinar link
Event Details & Registration: IEEE

Summary:
The Heterogeneous Integration Roadmap (HIR), released October 2019, is a roadmap to the future of electronics identifying technology requirements and potential solutions. The primary objective is to stimulate pre-competitive collaboration between industry, academia and government to accelerate progress. The roadmap offers professionals, industry, academia and research institutes a comprehensive, strategic forecast of technology over the next 15 years. The HIR also delivers a 25-year projection for heterogeneous integration of Emerging Research Devices and Emerging Research Materials with longer research-and-development timelines. With the release of the 2019 HIR edition, the preparation of the 2020 edition is underway.