Toward 100Gbps Fully Integrated Wireless Communication Transceivers 🗓

— How to implement highly integrated ultra-high-speed wireless transceivers.

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Organizer: IEEE Foothill & OC Jt. Sections Nanotechnology Council Chapter
Webinar Date: November 17, 2020 12 Noon – 1PM
Speaker: Dr. Huan Wang, Qualcomm
Location: On – Line at
Cost: none
RSVP: Not required

The future’s more connected societies are in sore need of high-speed point-to-point wireless links with a data rate comparable to wireline links in both indoor short-range and outdoor long-range scenarios. Enabling applications include: optical fiber replacement, high-capacity backhauls, close-proximity wireless data transfer, etc. High-speed communication relies on two major factors: bandwidth and modulation format. The vastly under-utilized mm-wave to sub-THz band is very attractive for this application. However, the abundance of bandwidth in mm-wave/sub-THz bands cannot be easily utilized with commercially available low-cost Silicon-based fabrication technologies. Meanwhile, increasing modulation order puts stringent requirement on the high-speed mixed-signal interface design, i.e. analog-to-digital converters, digital-to-analog-converters and digital signal processors. In short, conventional transceiver architectures encounter serious bottleneck that limits achievable data rate and posts significant concerns on system cost and efficiency. The state-of-the-art solutions will be presented and discussed first, followed by our proposed way of implementing highly integrated ultra-high-speed wireless transceivers.

Speaker Bio:
Huan Wang received his B.S. degree from Zhejiang University, Hangzhou, China, in 2011; M.S. degree from The University of Texas at Austin, Austin, Texas, USA, in 2013 and Ph.D degree from University of California, Irvine, CA, USA in 2020, all in Electrical Engineering. From 2013 to 2015, he was with Cirrus Logic, Austin, Texas, as an analog design engineer, where he was involved in the design of audio class-D amplifiers for mobile applications. He was an engineering intern with Qualcomm during the summer of 2012, 2016 and 2019. He is now with Qualcomm, San Diego, working on analog/RF IC design for wireless cellular communication. His research interest includes analog, RF and mm-wave/THz circuits and system design.