Meeting Date: Tuesday, April 18, 2017
Time: 6:00 PM Networking; 6:30 PM Presentation
Speaker: William C. Tang, Ph.D. of University of California at Irvine
Location: Broadcom, 5300 California Ave, Irvine
RSVP: Registration is appreciated, but not required. Everyone is invited. Dinner is provided at no cost.
Event Details: IEEE Event
According to the definition established by the US Food & Drug Administration (FDA), medical implants are devices or tissues that are placed inside or on the surface of the body. Many implants are prosthetics, intended to replace missing body parts. Other implants deliver medication, monitor body functions, or provide support to organs and tissues. Implants can be placed permanently or they can be removed once they are no longer needed. For example, stents or hip implants are intended to be permanent, while chemotherapy ports or screws to repair broken bones can be removed when they are no longer needed. Due to the risks associated with surgical complications, infections, foreign body rejection, allergic reactions, and other life-threatening issues, the great majority of medical implants are heavily regulated by the FDA with Class III designations. Since the early days of the development of biomedical implants, biocompatibility of materials and safe device operations inside the physiological environment have been identified as the single most important deciding factors for successful deployment. This presentation focuses on the findings and potential approaches on packaging for implantable biomedical devices, with specific examples cited from implantable neural probe arrays.
Bio: William C. Tang, Ph.D. received his BS, MS, and Ph.D. in Electrical Engineering & Computer Sciences from the University of California at Berkeley in 1980, 1982, and 1990, respectively. His seminal thesis work and invention on the electrostatic comb drive has become a crucial building block for many microactuator and microsensor research in the field, and was, and continues to be recognized internationally as one of the most influential and foundational work. Since his graduation, he continued his contribution to the MEMS field first in the automotive industry as a Research Senior at Ford Research Laboratory in Dearborn, Michigan, and as the Sensor Research Manager at Ford Microelectronics, Inc., in Colorado Springs, Colorado. In 1996, he joined the Jet Propulsion Laboratory, California Institute of Technology, where he was the Supervisor of the MEMS Technology Group, leading the pursuit of MEMS technology for space applications.