5G and IoT Design Innovation Through Simulation

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— IEEE San Diego Section Co-sponsored by VTS, APS, SPS, EMBS …
Meeting Date: September 20, 2017
Time: 6:00 PM Networking & Food; 6:30 PM Presentation
Speaker: Dr. Larry Williams, ANSYS Inc.
Location: Coleman University
Cost: none
RSVP: requested, through website
Event Details: IEEE vTools
Modern electromagnetic simulation is founded on the vision that all electronic design is fundamentally based on Maxwell’s Equations, thus solving them directly would one day become the basis for the highest performance design. That day is today.

Join us for an evening event and dinner as Dr. Williams presents how engineers deliver design innovation for 5G and IoT systems using advanced physics-based simulation. You will see that superior design can be delivered using advanced engineering simulation and high-performance computing leading to advantage for both large corporations and small start-ups.

Industry examples from 5G and IoT applications will be highlighted. An active phased array antenna system for real-time beamforming and high-bandwidth communications will be shown using multi-scale and multi-domain simulation. It will be shown that modern electromagnetic field solvers can combine with circuits and systems for base station antenna system modeling.

Topics in RFIC module design for sub-6GHz applications will be described, and layout-based design assembly will be covered to illustrate how a combination of multi-die laminate structures can be designed. Dr. Williams will also revisit a recent NXP presentation showing how they utilized a multiphysics design flow for large-signal RF Power devices allowing them to create a device model for RF circuit simulation but also to identify temperature distribution across wirebonds.

IoT examples will also be explored illustrating challenges of oil refinery antenna placement and antenna design for an IoT smart meter. The presentation concludes with multi-Physics design of smartphone handsets for sub-6GHz 5G Readiness showing antenna match sensitivity to temperature along with his vision on what the future will bring and how it will impact organizations that embrace it.

Bio: Dr. Larry Williams is Director of Product Management at ANSYS Inc., Electronics Business Unit. He is responsible for the strategic direction of the company’s electrical and electronics products, including the High Frequency Structure Simulator (HFSS) and Maxwell finite element simulators. Dr. Williams is an expert in the application of electromagnetic field simulation to the design of antennas, electromagnetic devices, and high-speed electronics. He has over 20 years’ experience in the fields of electromagnetics and communications engineering, has delivered technical lectures internationally, and has published numerous technical papers on the subject. He and his co-authors won the prestigious H.A. Wheeler Prize Paper Award in the IEEE Transactions on Antennas and Propagation, 1995, and the best paper award at DesignCon 2005. He serves on the UC Irvine Henry Samueli School of Engineering Dean’s Leadership Council and on the California State Polytechnic University Electrical Engineering Department Advisory Board.

Dr. Williams held various senior engineering positions in the Engineering Division of Hughes Aircraft Company, Radar Systems Group, where he was responsible for hardware design and development of advanced active phased array radar antennas, array element and aperture design, associated microwave subsystems, and antenna metrology. He received his Masters, Engineers, and Ph.D. degrees from UCLA in 1989, 1993 and 1995, respectively.