2nd UCLA CHIPS Workshop 🗓

–Poster sessions and panel discussions on the topics of Heterogeneous Integration, Flexible Hybrid Electronics, Fan-Out Wafer Level Processing, and Neuromorphic Computing.

Meeting
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— IEEE EDS …
Meeting Dates: November 1, 2017

Location: UCLA

RSVP: At www.conference.org
Summary:
The UCLA Center for Heterogeneous Integration and Performance Scaling is pleased to announce the 2nd UCLA CHIPS Workshop held at the UCLA Campus on Wednesday, November 1, 2017.

This year’s workshop will feature keynote presentations from DARPA, GlobalFoundries, TSMC, and ASE, that will highlight UCLA CHIPS research efforts since the first workshop in 2015. The keynote talks will set the tone for poster sessions and panel discussions on the topics of Heterogeneous Integration, Flexible Hybrid Electronics, Fan-Out Wafer Level Processing, and Neuromorphic Computing. An optional Lab tour is scheduled at the end of the day.