Past Meetings/Webinars

Analog/Mixed-Signal Design in FinFET 🗓

— Young Professionals & Students career coaching session after the talk

— IEEE San Diego Section
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Meeting Date: Wednesday May 31, 2017
Time: 6:30 PM Networking & Food; 7:00 PM Presentation
Speaker: Dr. Alvin Loke of Qualcomm
Location: San Diego
Cost: Free to IEEE, Qualcomm and students with ID; all others $5 cash only at the door.
RSVP: requested, through website
Event Details: IEEE vTools
Summary:
Continued consumer demand for mobile ICs has propelled CMOS scaling to arrive at the finFET with foundry offerings starting at 16/14 nm. The compact 3-D structure of the finFET offers superior short-channel control that achieves digital power reduction and adequate device performance. As SoC technology remains dictated by logic and SRAM scaling needs, designers of analog/mixed-signal subsystems must adapt to new design constraints. We attempt to summarize the challenges and considerations faced when porting analog/mixed-signal designs to finFET. At 16/14 nm, designers must also cope with many accumulated implications of earlier scaling innovations leading to the finFET.

In addition, the IEEE San Diego Young Professionals Section is offering a Young Professionals & Students career coaching session after the talk and a Q&A

Bio: Alvin Loke received a B.A.Sc. in engineering physics from the University of British Columbia, and M.S. and Ph.D. in electrical engineering from Stanford. He worked on CMOS process integration for several years at HP Labs and on assignment at Chartered Semiconductor. Since 2001, he has been designing circuits for a variety of wireline links and addressing next-generation CMOS analog/mixed-signal concerns at Agilent and Advanced Micro Devices in Fort Collins, CO, and most recently at Qualcomm in San Diego, CA. He has authored several dozen publications and holds 19 US patents. Alvin has served as Technical Program Committee member of CICC, IEEE Chapter Chair, Guest Editor of the IEEE Journal of Solid-State Circuits, Industrial Advisory Board member at Colorado State University, and IEEE Distinguished Lecturer.

EMC Electromagnetic Environmental Effects in the Military –Distinguished Lecturer Talk 🗓

— includes first-hand experiences of work done in the Afghan theatre

— IEEE San Diego
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Meeting Date: May 24, 2017
Time: 6:00 PM Networking & Food; 6:30 PM Presentation
Speaker: Kris Hatashita
Location: San Diego
Cost: none
RSVP: requested, through website
Event Details: IEEE vTools

Summary:
Military electromagnetic compatibility (EMC) is a matter of life and death as modern war-fighters rely on the safe, secure and reliable functioning of their devices. Military EMC includes aspects of electronic interoperability that are seldom or never considered in the commercial realm. This talk presents technical details of EMC consideration in tactical and strategic military operations. The topics discussed include hazards of electromagnetic radiation to ordnance (HERO), electromagnetic data security (EMSEC), counter improvised explosive device (CIED) EMC issues and includes first-hand experiences of work done in the Afghan theatre.

Bio: Kris Hatashita has been the Electromagnetic Environmental Effects subject matter expert for the Canadian Army tactical communications group since 2002 where he plans and oversees Canadian Army compliance with EMI, EMC, EMSEC, and RF safety requirements. Prior to this, Kris was an independent E3 consultant and President of ISOTEC Corporation whose clients included the Canadian Department of National Defence, the Canadian Army, Navy and Air Force, the Royal Canadian Mounted Police (RCMP), the Communication Security Establishment (CSE) and the Department of Foreign Affairs and International Trade. Kris has worked at or with many technology corporations throughout his career including General Dynamics Canada, Digital Equipment Corporation, Zenith Corporation and Hewlett-Packard. Kris’s career in E3 began in 1985 in the aerospace industry after completing a BSc in Physics at the University of Waterloo. While working for Garrett Aerospace, Kris was selected to undergo training through CSE in the joint Canada-US Industrial TEMPEST Program. Through this program, Kris became the first non-American to become a Certified TEMPEST Professional – Level II by the United States National Security Agency – a certification he holds to this day. Kris is the General Chair of the 2016 IEEE International EMC Symposium to be held in Ottawa, Canada.

CYBER ATTACK TECHNIQUES 🗓

— FBI reveals basic attack scenarios & show how attackers evolve and adjust to the changing attack surface.

—IEEE OC CyberSecurity Monthly Technical Talk
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Meeting Date: Wednesday, June 28, 2017
Time: 6:00 PM Networking & food; 6:30 PM Presentation
Speaker: Jensen Penalosa, Special Agent with the FBI
Location: ATEP-IVC, Irvine
Cost: none. Food and beverage at this event is free and is sponsored by CyberSecurity SIG.
RSVP: requested, through website. Parking pass available
Event Details: IEEE vTools

Summary:
Cyber attackers are constantly changing their tactics, techniques and procedures. SSA Penalosa will walk through some basic attack scenarios and demonstrate how attackers evolve and adjust to the changing attack surface.

Bio: Supervisory Special Agent Jensen Penalosa has been a Special Agent with the FBI since 2005. In 2014, SSA Penalosa was assigned to the Orange County Resident Agency, where he currently supervises the Cyber Squad responsible for conducting counterterrorism, counterintelligence and criminal cyber investigations.
SSA Penalosa is a Certified Information Systems Security Professional (CISSP), GIAC certified Incident Handler, Forensic Analyst, Web Application Penetration Tester, and holds a Bachelor of Science degree in Computer Science.
From 2012 to 2014, SSA Penalosa supervised the FBI Cyber Crime Squad embedded in the Los Angeles Electronic Crimes Task Force in Los Angeles. Prior to entering on duty with the FBI, SSA Penalosa was employed by FileNet Corporation as a software engineer.

Mechanisms Responsible for Loss Tangent and Temperature Coefficient of Resonant Frequency in Modern Microwave Ceramics 🗓

— Perovskite microwave ceramics for wireless communication systems

— IEEE Orange County CPMT Chapter
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Meeting Date: Tuesday May 16, 2017
Time: 6:30 PM Networking; 7:00 PM Presentation
Speaker: Dr. Shengke Zhang of Wispry Inc.
Location: Broadcom, Irvine
Cost: none
RSVP: Registration is appreciated, but not required. Everyone is invited. Dinner is provided at no cost.
Event Details: IEEE/vTools
Summary:
Perovskite microwave ceramics are of significant practical importance for wireless communication systems due to their superior performance including ultra-low microwave loss and “low/no” frequency drift with respect to temperature variations. However, a first-principles understanding of what mechanisms are responsible for the microwave loss and temperature coefficient of resonant frequency (τf) have not been firmly established. In this talk, I will focus our discussions on transition-metal-doped Ba(Zn1/3Ta2/3)O3 (BZT) and Ba(Zn1/3Nb2/3)O3 (BZN) perovskite ceramics because they are the highest performers at room temperature that are commercially available and widely used in cellular base stations. The properties of commercial microwave ceramics are optimized by adding transition-metal dopants or alloying agents, such as Ni, Co, or Mn to adjust τf to near-zero. This occurs as a result of the temperature dependence of dielectric constant offsetting the thermal expansion. At cryogenic temperatures, we discover that microwave loss in these commercial materials is dominated by the spin-excitation process within the unpaired d-shell electronic spins existing in the transition-metal additives, a loss mechanism differing from the usual suspects. The temperature coefficient of resonant frequency (τf) of a microwave resonator is determined by three fundamental materials properties according to the following equation: τf = – (½ τε + ½ τμ + αL), where αL, τε and τμare defined as the linear temperature coefficients of the lattice constant, dielectric constant, and magnetic permeability, respectively. We have experimentally determined each of these three parameters for undoped and Ni-doped BZT materials. These results, in combination with density functional theory (DFT) calculations, have allowed us to quantitatively model the physical processes that determine τf with reasonable accuracy.

Bio: Shengke Zhang is currently a Senior RF-MEMS Reliability/Failure Analysis Engineer at Wispry Inc., an industrial leader in high-performance tunable radio frequency (RF) semiconductor products for the wireless industry. He earned his M.S. and Ph.D. degrees in Materials Science and Engineering from Arizona State University in 2012 and 2016. He received his B.S. degree in Materials Control and Engineering in 2011 at Huazhong University of Science and Technology in China. Dr. Zhang’s research focuses on developing high performance microwave dielectric resonators and superconducting resonators for wireless communication and quantum computing applications. He has 4 peer-reviewed publications (3 first-authored) in the top journals of the field such as Journal of the American Ceramic Society and Applied Physics Letter, and more than 20 presentations/invited talks in leading international conferences.

FDA’s New Focus on Cybersecurity 🗓

— current landscape and recent history of FDA focus on cybersecurity

— A joint presentation hosted by IEEE Orange County Computer Society (OCCS), The Orange County IEEE Cybersecurity Special Interest Group (CybersecuritySIG), and the Orange County IEEE Engineering in Medicine & Biology Society (IEEE EMBS).
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Meeting Date: Monday, May 22, 2017
Time: 6:30 PM Networking; 7:00 PM Presentation
Speaker: Daniel Beard, Promenade Software Inc.
Location: Orange – Chapman University
Cost: none
RSVP: requested
Event Details: IEEE/vTools
Summary:
It’s no secret that he FDA has been focusing intensely on cybersecurity over the past couple of years.
The premarket and postmarket cybersecurity guidances put more responsibility on the manufacturer than ever before, and many manufacturers are confused about what they need to do.
This talk will outline the current landscape and recent history explaining why the FDA is intensely
focusing on cybersecurity. It will also give recommendations and examples on the quickest way
for manufacturers to come up to speed with the guidances.

Bio: Daniel Beard is a founder and VP of Technology at Promenade Software, Inc.. He is passionate about technology and communications, and strives to bring best-in-class infrastructure and techniques to the Medical Device Sector’s connected devices. His background includes over 7 years in the Medical Device sector, creating custom software for IVD and Therapy devices.
Daniel is obsessed with cyber-security in infrastructure. He is a founding member of MedISAO, an Information Sharing an Analysis Organization tailored to medical device manufacturers, consults on how to improve device security in regulated manufacturing environments, and contributes to multiple open-source security tools.

The Learning Path Toward a Smart Grid: Changes in Standards and Business Practices Post-2018 🗓

— (IEEE SmartGrid) – interoperability, interconnection, commissioning, successes, developments, benefits …

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Webinar Date: Thursday, May 18, 2017
Time: 10:00 AM (PDT)
Speaker: Mark Siira, Director, Utility Compliance and Solutions, ComRent International
Location: on the Web
Cost: none
RSVP: required
Event Details & Registration: smartgrid.ieee.org

Summary: This webinar will provide the attendees with a glimpse of some changes that will occur in business practices, post-2018. We will review the drivers of the oncoming change and some common themes that are emerging in the standards requirements and some key topics such as interoperability, interconnection, and commissioning.
We will briefly review the evolution of the smart grid standards to date.
We will review what standards are being developed and the benefits of these. We will highlight some successes and challenges we face moving forward.
Finally, we will review some of the business implications of these changes from the perspective of equipment manufacturers, developers and service providers.


Mark Siira is Director, Utility Compliance and Solutions for ComRent International – a leader in load testing solutions for critical facilities and utility-scale systems. Mark is responsible for strategic accounts, technology strategy, and external communication content.
Mark is a senior member of IEEE and Chair of Standards Coordinating Committee 21. In this role, he leads the development of all interconnection and interoperability standards for fuel cells, photovoltaics, dispersed generation and energy storage. He is Vice-Chair for IEEE1547 Interconnection Standard Revision (new test requirements).
Mark is active in the IEEE Power Systems Relaying Committee and UL Standards Technical Panels 1741 (Inverters). He holds a Bachelor of Mechanical Engineering from Kettering University and and MBA from Harvard Business School.

The Future of Additive Manufacturing of Radio-Frequency Components 🗓

— 3D printing, raw materials, deposition, effects on design, agile, state of practice …

Webinar Sponsor: Proceedings of the IEEE
Speakers: • Roberto Sorrentino (University of Perugia, Italy); • Petronilo Martin-Iglesias (European Space Agency, The Netherlands); • Oscar Antonio Peverini (CNR – IEIIT, Italy); • Thomas M. Weller (University of South Florida, USA)
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Meeting Date: Thursday, May 18, 2017
Time: 8:00 AM (PDT)
Cost: none
Location: on the Internet
Reservations: bit.ly/2pwEhVK
Summary: Additive manufacturing (AM), commonly referred to as 3D printing, is a booming technology (or, better, a set of technologies) in a number of application areas, including architecture, automotive, aerospace, biotech, electronics, fashion and food to name just a few. AM actually encompasses a broad array of processes aimed to directly synthesize a 3D object from raw materials, using a layer-by-layer deposition or growth sequence under computer control.
In the electronic market, and specifically in the RF and Microwave field, from expensive satellite communication systems to high volume microwave electronics, AM has the potential to change the way systems are designed, integrated and operated and is therefore considered a strategic technology and a key enabler for accelerated engineering processes, highly efficient products and new agile supply chains. Totally new design approaches that will improve performance, make mass optimization practical, allow the miniaturization of complex systems and dramatically reduce the design/manufacturing/assembly cycle costs are possible with AM. Along with these attributes AM provides an environmentally-friendly alternative to conventional manufacturing.
This webinar will present a review of the current state of practice in additive manufacturing for RF/microwave applications including those areas where much remains to be done.

IEEE International Symposium on Asynchronous Circuits and Systems (ASYNC) 🗓

— (IEEE CS) – design, applications, integration, emerging technologies …

Conference Dates: May 21-24, 2017
Location: Bahia Resort Hotel, 998 West Mission Bay Dr, San Diego
Cost: $840 IEEE Members, 1050 non-members
Information and to register: www.async2017.org
Summary: The International Symposium on Asynchronous Circuits and Systems (ASYNC) is the premier forum for researchers to present their latest findings in the area of asynchronous design. Besides a regular paper track, the conference will also hold a special industrial papers track and a “fresh ideas” workshop.
The scope ranges from design, synthesis, and test, to asynchronous applications in system-level integration and emerging computing technologies. Topics o include: Mixed-timed circuits, GALS systems, Networks-on-Chip, and multi-chip interconnects; Elastic and latency-tolerant synchronous design; Asynchronous pipelines, architectures, CPUs, and memories; Asynchronous ultra-low power systems, energy harvesting, and mixed-signal/analogue; Asynchronous logic in power-constrained applications; Asynchronous techniques for 3D integration; Asynchrony in emerging technologies, including bio, neural, nano, neuromophic, and quantum computing; CAD tools for asynchronous design, synthesis, analysis, and optimization; Formal methods for verification and performance/power analysis; Test, security, and fault tolerance; Asynchronous variability-tolerant, resilient, and/or rad-hard design and design for manufacturing; Case studies.

2017 IEEE Intelligent Vehicles Symposium (IV) 🗓

— (IEEE ITS) – self-driving vehicles, vehicle control, situation analysis, Radar, Lidar, V2x …

Conference Dates: June 11-14, 2017
Location: Crown Plaza Hotel, 300 N Harbor Dr, Redondo Beach
Cost: $700 IEEE Members, $750 non-members
RSVP: At iv2017.org
Summary: The goal of the symposium is to bring together researchers, engineers, practitioners, and students, from industry, universities and government agencies to present their latest work and to discuss research and applications for Intelligent Vehicles and Vehicle-Infrastructure Cooperation. Includes technical sessions, workshops, poster sessions, exhibition, and technical visits.

Distributed Energy Resources: Where to Start? How to Build an ROI-Based Roadmap 🗓

— (IEEE SmartGrid) – grid edge, customer additions, rooftop solar, smart appliances, EVs …

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Webinar Date: Thursday, May 4, 2017
Time: 10:00 AM (PDT)
Speaker: Amar Pradhan, IBM Energy & Utilities
Location: on the Web
Cost: none
RSVP: required
Event Details & Registration: http://smartgrid.ieee.org
Summary: New grid edge technologies are proliferating, and utilities must figure out how to leverage them, or get sidelined in areas of growth. Utility customers are installing rooftop solar, smart appliances, EVs, etc, outside the traditional purview of the utility or regulators.
The mix of IT technologies and business models to optimally interact with these new customer-sited resources is critical. What is needed is an expert system integrator who can assess the Utility’s ‘as is’ condition, and roadmap deployment of internal and external technologies that optimally bring the utility to the ‘to be’ scenario that allows them to most profitably leverage DER (Distributed Energy Resources).
IBM is such a system integrator, and this webinar will explain how to tactically create and deliver such a roadmap.

Bio: Amar Pradhan is a member of IBM’s global Energy & Utilities organization and leader of strategic incubation. He focuses on expanding big data and artificial intelligence offerings into emerging areas like distributed energy resources and evolving power trading markets. He is responsible to incubate IBM’s new offerings to energy & utility companies and lead their go-to-market strategy.
He has broad international experience developing and selling energy and industrial solutions. Prior to IBM, Amar was an energy technology entrepreneur with a focus on the nexus of information technology and power generation. He launched, raised financing, and sold companies focused on unit commitment optimization for energy storage, operational analytics for wind turbines, and nanotechnology for lithium ion batteries.
Amar holds a bachelors degree in Mechanical Engineering from the University of California, Berkeley and an MBA from Columbia University.