Past Meetings/Webinars

Vulnerabilities of Deep Learning in Adversarial and/or Degraded Imagery 🗓

IEEE OC Section & Computer Society
register
Meeting Date: June 28, 2017
Time: 6:00 PM Networking & Food; 6:30 PM Presentation
Speaker: Dr Joshua Harguess of SPAWAR Systems Center Pacific
Location: Qualcomm San Diego
Cost: none
RSVP: requested
Event Details: IEEE vTools

Summary: Deep learning has continued to gain momentum in applications across many critical areas of research in computer vision and machine learning. In particular, deep learning networks have had much success in image classification, especially when training data is abundantly available. However, researchers have shown vulnerabilities to these deep learning networks that are not well understood. For instance, when estimating optical flow from real-world video data, such as that taken of full-motion-video (FMV) from unmanned vehicles, surveillance systems, and other sources, the results from deep learning and other computer vision approaches are often undesirable. Additionally, several researchers have exposed potential vulnerabilities of deep learning networks to carefully crafted adversarial imagery. In this talk, we’ll examine the effects of real-world video data on motion estimation and a potential path forward to detecting adversarial imagery using image quality metrics.

Bio: Dr Joshua Harguess
*PhD Electrical and Computer Engineering, 2011, University of Texas Austin,
Portfolio in Applied Statistical Modeling; MS Computational & Applied Mathematics, 2007, University of Texas Austin,
*Research Scientist, SPAWAR Systems Center Pacific, San Diego,
*Successfully managed and executed on the continuing Independent Applied Research project Video notation, Search and Tagging (VAST).
*Active member of the Motion Imagery Standards Board (MISB) and image and video quality working group.
* In the Automated Imagery Analysis group, performed research on ship classification using state-of-the-art mthods and the effects of pre-processing (SPIE 2012), anomaly detection for ship detection and tracking from full-motion video from UAV. Most recently, developed new algorithm using sparse representation for anomaly detection with applications in many domains.
*Performed research into using evolutionary techniques to train a deep learning network to learn features for classification of maritime imagery (ICLR 2014 & GECCO 2014).
* In the Unmanned Systems group, performed research on automatic calibration between stereo and infrared (IR) cameras for robot vision and navigation (SPIE2014), motion estimation and optical/range flow for robot ego-motion estimation (PLANS2014), and studying the effects of optical flow on degraded imagery.
*Co-founder of both the Computer Vision and the Machine Learning Series group at SSC Pacific which consists of several researchers across the center that meet biweekly to discuss computer vision and machine learning research

A Fully Automatic Test System for Characterizing Wide-I/O Micro-Bump Probe Cards 🗓

— (IEEE SPECTRUM) – 2.5D- and 3D-stacked ICs, probe station, system components, experimental results …

register
Webinar Date: Thursday, July 6, 2017
Time: 9:00 AM (PDT)
Speakers: Erik Jan Marinissen, Principal Scientist, imec; Jörg Kiesewetter, Director of Engineering, Cascade Microtech GmbH; and Ken Smith, Principal Engineer, FormFactor
Location: on the Web
Cost: none
RSVP: required
Event Details & Registration: spectrum.ieee.org/webinars

Summary: In the context of pre-, mid-, and post-bond testing of dies in a 2.5D- and 3D-stacked IC, a fully automatic test system for characterizing advanced probe cards able to probe on large-array fine-pitch micro-bumps (such as JEDEC’s Wide-I/O Mobile DRAM interfaces) has been specified, developed, installed, and brought into full operation. The system is based on a CM300 probe station from Cascade Microtech (now FormFactor) and National Instruments PXI test instrumentation and complemented by in-house-developed software for automatic test generation and data analysis and visualization. The system is successfully used in conjunction with FormFactor’s Pyramid Probe RBI probe technology on Wide-I/O 1 and 2 micro-bump arrays on ø300mm wafers designed and manufactured by imec. This presentation describes the various system components in hardware and software, and experimental results obtained with several test wafers.

Erik Jan Marinissen is Principal Scientist at imec, the Leuven, Belgium research institute, where he is responsible for research on test and design-for-test, covering topics as diverse as TSV-based 3D-stacked ICs, silicon photonics, CMOS technology nodes below 10nm, and STT-MRAMs. In addition, he is Visiting Researcher at Eindhoven University of Technology, the Netherlands. Previously, he worked at NXP Semiconductors and Philips Research Laboratories in Eindhoven. Marinissen holds an MSc degree in computing science and a PDEng degree in software technology, both from Eindhoven University of Technology. He is author or co-author of 280 journal and conference papers and a named inventor on fifteen granted US/EP patent families. Marinissen is recipient of the Most Significant Paper Awards at ITC 2008 and ITC 2010, Best Paper Awards at the Chrysler-Delco-Ford Automotive Electronics Reliability Workshop 1995 and the IEEE International Board Test Workshop 2002, the Most Inspirational Presentation Award at the IEEE Semiconductor Wafer Test Workshop 2013, the HiPEAC Tech Transfer Award 2015, the SEMI Best ATE Paper Award 2016, and finalist for the National Instruments’ Engineering Impact Award 2017.
Marinissen served as Editor-in-Chief of IEEE Std 1500 and as Founder and Chair (currently Vice-Chair) of the IEEE Std P1838 Working Group on 3D test access. He is founder of the workshops ‘Diagnostic Services in Network-on-Chips’ (DSNOC), DATE’s Friday 3D Integration, and the IEEE ‘International Workshop on Testing Three-Dimensional Integrated Circuits’ (3D-TEST). He has been Program Chair of DDECS 2002, ETS 2006, 3D-TEST 2009-15, and DATE 2013, and General Chair of ETW 2003, DSNOC 2007-08, 3DIW 2009-10, and serves on numerous conference committees, including ATS, DATE, ETS, ITC, ITC-Asia and VTS. He serves on the editorial boards of IEEE ‘Design & Test’, IET ‘Computers and Digital Techniques’, and Springer’s ‘Journal of Electronic Testing: Theory and Applications’. He is a Fellow of IEEE and Golden Core Member of Computer Society.
Jörg Kiesewetter is Director of Engineering at Cascade Microtech GmbH, a FormFactor company, in Thiendorf, Germany. Jörg has a background in mechanical engineering. He started to work in the semiconductor equipment industry joining the Karl Süss Dresden GmbH in 1990. With his background in mechanical engineering he worked in different projects and roles like development of positioners, mask aligners, anodic bonders, and probe stations. He worked as a project leader in the field of development of a fully automatic PCB mask-aligner from 1995 to 2000. Since 2001 he is managing the engineering group of the Dresden branch of the Cascade Microtech GmbH. In this role his main focus is the development of fully automatic, semi-automatic, and manual probe stations for engineering and process monitoring applications. His ideas are involved in more than 10 patent families and he contributed to publications in particular in the field of 3D TSV and fine-pitch micro-bump testing, a field he is working in for 10 years.
Ken Smith is Principal Engineer at FormFactor, in Beaverton, Oregon. Ken’s professional focus is on high-performance test and measurement issues, primarily in the interconnect and test environment domains. Since joining Cascade Microtech in the early ’90s he has generated more than 50 papers and 40 patents. Key contributions include the MicroChamber, allowing femtoamp-level on-wafer measurements, and MicroScrub for the Pyramid Probe business unit he established. At Tektronix he designed products and processes for multi-GHz hybrids for oscilloscopes and ATE pin drivers, managed the hybrids circuits R&D and production operations, and built the first financially successful membrane probes for high-speed digitizer IC test. His current focus is on new test solutions for the extremely challenging designs allowed by 3D TSV and fine-pitch micro-bumps.

Advanced Data Acquisition and Logging Systems 🗓

— (IEEE SPECTRUM) – data acquisition, sensor data, IoT, real-time analysis, decisions, best practices, case studies …

register
Webinar Date: Thursday, June 22, 2017
Time: 10:00 AM (PDT)
Speakers: Rafayel Ghasabyan, founder and CEO, RAFA Solutions; Arev Hambardzumyan, CTO, RAFA Solutions
Location: on the Web
Cost: none
RSVP: required
Event Details & Registration: spectrum.ieee.org/webinars

Summary: It is difficult to envision an industrial automation application that does not include a data acquisition system. Most applications include sensor data that must be acquired, analyzed, and logged, using acquisition (DAQ) systems that can be as diverse as the sensors themselves.
With the rise of the Internet of Things, DAQ requirements are becoming even more strict, bringing new challenges. Today’s data acquisition systems should perform analysis in real time, work with large amounts of analog data, and make decisions based on those results. The importance of a robust, real-time, decision-making, signal-processing system FPGA platforms the best fit for many such applications.
Designers of DAQ systems need to consider scalability, portability, and stable operation. At this session, we will explore the main challenges and best practices in data-logging system design, particularly in the LabVIEW environment.
The webinar examines the underlying implementation of an object-oriented approach to application design, DAQ tips and tricks for FPGA platforms, and an object-oriented programming architecture for real-time and host applications.
The session also explores several case studies of developed DAQ systems, showing the main challenges faced and the solutions implemented in the projects.

Rafayel Ghasabyan is the founder and CEO of RAFA Solutions, an ISO 9001:2015 and CSIA certified systems integrator specializing in smart machines and data acquisition/control systems.
He is an entrepreneur and business mentor with more than a decade of experience in multinational engineering companies, and is currently a lecturer in Systems Engineering at Russian-Armenian (Slavonic) University.
Rafayel holds a BS in Computer Science and a MS in Electrical Engineering from the State Engineering University of Armenia.
Arev Hambardzumyan is the CTO of RAFA Solutions, responsible for product design and the future technological growth of the company. Her 12 years of professional experience in system verification, testing, analysis and project coordination, include 6 years developing control and automation systems in such fields as machine automation, testing machines, oil and gas, in such application ranging from data acquisition systems for pipeline monitoring to universal memory testers.
Before moving to RAFA Solutions as its first systems engineer in 2012, Arev worked at Synopsys as an IC circuit designer. She is Certified LabVIEW Architect and the first Certified LabVIEW Embedded Developer in the region. Arev holds an MS degree in Electrical Engineering from the State Engineering University of Armenia.

Why the More- and All-Electric Aircraft Needs Power Electronics 🗓

— (IEEE IAS & TEC) – Boeing 787, Airbus A380, power conversion, challenging conditions, weight, volume, cost, reliability, case studies …

register
Webinar Date: Thursday, September 21, 2017
Time: 7:00 AM (EDT)
Speaker: Patrick Wheeler, University of Nottingham
Location: on the Web
Cost: none
RSVP: required
Event Details & Registration: tec.ieee.org/education/webinars

Summary: There has recently been a major change in the design of aircraft. Electrical systems are being used in applications which have traditionally been powered by hydraulic or pneumatic sources. The Boeing 787 and the Airbus A380 both have significantly larger electrical/electronics systems than any previous aircraft. The most important enabling technology for the More Electric Aircraft is been power electronics. Without power conversion none of the benefits of this technology would be possible. However, aerospace applications present some challenging conditions for power electronics and there are still a number of areas where improvements must be made in terms of the weight, volume, cost and reliability of systems. This presentation will introduce the More Electric Aircraft concept and investigate the potential benefits of the technology before considering the challenges our community will have to meet to make the concept of Electric Propulsion of large aircraft possible. The talk will be illustrated with a selection of case studies of systems that have been developed at the University of Nottingham, UK.
Prof Pat Wheeler received his BEng [Hons] degree in 1990 from the University of Bristol, UK. He received his PhD degree in Electrical Engineering for his work on Matrix Converters from the University of Bristol, UK in 1994. In 1993 he moved to the University of Nottingham and worked as a research assistant in the Department of Electrical and Electronic Engineering. In 1996 he became a Lecturer in the Power Electronics, Machines and Control Group at the University of Nottingham, UK. Since January 2008 he has been a Full Professor in the same research group. He is currently Head of the Department of Electrical and Electronic Engineering at the University of Nottingham. He is an IEEE PELs ‘Member at Large’ and an IEEE PELs Distinguished Lecturer. He has published 400 academic publications in leading international conferences and journals.

When Products Harm – and – Overview of 2017 IEEE-PSES Symposium, May 7- 9 – San Jose, CA 🗓

A classic product Liability Study, from the Engineer’s point of view.

— IEEE PSES OC Chapter —
register
Meeting Date: June 27, 2017
Time: 6:00 PM Networking & Food; 7:00 PM Presentation
Speaker: (On the Video) Gary Tornquist, Director of Product Safety, Microsoft Corp
and also Live Bansi Patel
Location: Irvine
Cost: none
RSVP: requested, through website by 5PM 6/27
Event Details: PSES Site
Summary: This video presentation was made by Gary at the 2017 IEEE Symposium on Product Compliance Engineering. It is a comprehensive presentation of what can happen, and the legal consequences, if your product does harm years after it has been in production. Included will be an interactive discussion of the video.
Also on the double bill- Overview of 2017 IEEE-PSES Symposium, May 7, 8, 9 – San Jose, CA

Bio:
Gary Tornquist, Director of Product Safety, Microsoft Corp

Bansi Patel is a safety consultant for compliance engineering for electrical and electro-mechanical products. He is in the field for over 30 years. He is chair for IEEE 1184, guidelines for battery for UPS Systems, He is board of governors for Product safety engineering society. He has been active in standards develop activities for UL, CSA, IEEE and IEC for past 30 plus years.

2017 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting 🗓

Covers all aspects of antennas, radio propagation, numerical modeling, measurements, electromagnetic physics, and radio frequency applications.

IEEE Antennas and Propagation Society & International Union of Radio Science – URSI
Meeting Dates: July 9 – 14, 2017

Location: The Manchester Grand Hyatt San Diego

RSVP: At IEEE AP-S
Summary: This conference is the premier international symposium on the topic of antennas and propagation. It covers all aspects of antennas, radio propagation, numerical modeling, measurements, electromagnetic physics, and radio frequency applications.
This year’s program will include a wide range of technical sessions, workshops, and short courses, as well as exhibits. It will also have a range of specific activities for students and young professionals. This meeting is intended to be the premier international forum for the exchange of ideas on state-of-the-art research in antennas, propagation, electromagnetic engineering, and radio science. Through a range of technical and social activities, it will provide the opportunity to interact with the world’s leading experts in antennas and propagation from academia, industry, and government.

2017 IEEE 18th International Conference on Information Reuse and Integration (IRI) 🗓

This conference explores three major tracks: information reuse, information integration, and reusable systems.

— IEEE Computer Society
Meeting Dates: August 3 – 5, 2017
Location: SHERATON MISSION VALLEY SAN DIEGO HOTEL
RSVP: At IEEE IRI 2017

Summary: This conference explores three major tracks: information reuse, information integration, and reusable systems. Information reuse explores theory and practice of optimizing representation; information integration focuses on innovative strategies and algorithms for applying integration approaches in novel domains; and reusable systemsfocus on developing and deploying models and corresponding processes that enable Information Reuse and Integration to play a pivotal role in enhancing decision-making processes in various application domains.

5G Technologies and Standards – 🗓

Presentation by IEEE Distinguished Lecturer Dr. Liangping Ma

— IEEE Buenaventura Section
register
Meeting Date: June 20, 2017
Time: 6:30 PM Networking & Food; 7:00 PM Presentation
Speaker: Dr. Liangping Ma, InterDigital, Inc.
Location: Newbury Park, Skyworks Solutions
Cost: none
RSVP: requested,
Event Details: IEEE vTools

Summary:
The buzz word 5G has generated a lot of excitement recently. But what is 5G? How is it different from the existing standards such as LTE and Wi-Fi? In this talk, we give an overview of 5G. We then focus on several key technologies of 5G, including waveforms, numerology, channel coding and beamforming, and explain how they may deliver the promised performance. We also briefly cover the status of 5G products and deployment

Bio: Liangping Ma is a member of the Technical Staff in the San Diego, CA office of InterDigital, Inc., a mobile technology company. His current research interests include 5G radio access networks, ultra-reliable and low-latency video communication, and cognitive radios. He led the research on Quality of Experience (QoE) based optimization for video streaming and interactive video communication. Prior to 2009, he was with San Diego Research Center and Argon ST (acquired by Boeing), where he led research on cognitive radios and wireless sensor networks and served as the principal investigators of two projects supported by the Department of Defense and the National Science Foundation. He is the co-inventor of more than 40 patents and the author/co-author of more than 50 journal and conference papers. He has been the Chair of the San Diego Chapter of the IEEE Communication Society since 2014. He received his PhD from University of Delaware in 2004 and his B.S. degree from Wuhan University, China, in 1998.

5G: Technologies and Standards 🗓

Presentation on 5G Technologies and Standards given by an IEEE ComSoc Distinguished Lecturer, Dr. Liangping Ma

— IEEE Communications, Signal Processing and Vehicular Technologies Joint Chapter – Co-sponsored by The Aerospace Corporation
register
Meeting Date: June 22, 2017
Time: 11:30 PM Networking & Food; 12:00 PM Presentation
Speaker: Dr. Liangping Ma, InterDigital, Inc
Location: The Aerospace Corporation El Secundo
Cost: none,
RSVP: requested,
Event Details: IEEE vTools

Summary: The buzz word 5G has generated a lot of excitement recently. But what is 5G? How is it different from the existing standards such as LTE and Wi-Fi? In this talk, we give an overview of 5G. We then focus on several key technologies of 5G, including waveforms, numerology, channel coding and beamforming, and explain how they may deliver the promised performance. We also briefly cover the status of 5G products and deployment.
Bio: Liangping Ma is with InterDigital, Inc., a mobile technology company. His current research interests include 5G radio access networks, ultra-reliable and low-latency video communication, and cognitive radios. He led the research on Quality of Experience (QoE) based optimization for video streaming and interactive video communication. Prior to 2009, he was with San Diego Research Center and Argon ST (acquired by Boeing), where he led research on cognitive radios and wireless sensor networks and served as the principal investigators of two projects supported by the Department of Defense and the National Science Foundation. He is the co-inventor of more than 40 patents and the author/co-author of more than 50 journal and conference papers. He has been the Chair of the San Diego Chapter of the IEEE Communication Society since 2014. He received his PhD from University of Delaware in 2004 and his B.S. degree from Wuhan University, China, in 1998.

Cha for Tea – IEEE Young Professionals Meet for Boba 🗓

Free Boba, board games, in a casual atmosphere

OC IEEE Young Professionals –

Meeting Date: Tuesday, August 8, 2017
Time: 6:30 – 9:30 PM
Dinner can be bought at any of the restaurants in UTC
Location: Cha For Tea, 4187 Campus Dr. M173, Irvine
Cost: none
RSVP: Just show up

Summary: OC IEEE Young Professionals is hosting our monthly Boba Night at Cha for Tea! Come join us for free Boba, board games and a casual atmosphere!